Senior Package Design Engineer

Job Descriptions

1. Evaluate and select chip packaging solutions, including assessment of

substrate/package factory capabilities, BOM formulation, packaging

size/stacking specification and ballmap layout.

2. Collaborate with internal and customer backend teams for bump selection,

layout, and verification.

3. Iterative design of high-speed Serdes, DDR, HBM PHY. Packaging

development related to IPs.

4. Design of packaging substrates and related document outputs, including

substrate layout, POD, gerber, assembly instructions, etc.

5. Collaborate with SI/PI teams and system design teams for packaging

optimization.

6. Coordinate and assist in problem-solving during production stages, conduct

failure analysis, and assist in process improvements at packaging factories.

7. Develop advanced packaging 2.5D, 3D processes, and packaging

technologies.

Job Requirements

1. Bachelor's degree or above in semiconductor packaging / materials /

mechanical engineering, with more than 8 years of full-time packaging

design experience.

2. Familiarity with and understanding of process flows and design points of

FCBGA, FCCSP, WLCSP, WLBGA, MCM, SiP and other packaging types.

Proficiency in using Cadence APD and AutoCAD.

3. Understanding of various performance indicators and key points in

packaging.

4. Familiar with packaging-related reliability testing standards.
5. Experience in 2.5D/3D packaging is a plus.
6. Strong team spirit, willing to communicate and share knowledge.

Location:Penang